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Division Profile
Division Profile
Our Lithography Division specializes in micro- and nano-scale patterning for advanced sensor fabrication, optical structures, and microelectronic applications.
Using both photolithography and maskless lithography techniques, we enable high-precision definition of electrodes, diffractive surfaces, and microstructures compatible with various thin-film deposition and etching processes.
Our Lithography Division specializes in micro- and nano-scale patterning for advanced sensor fabrication, optical structures, and microelectronic applications.
Using both photolithography and maskless lithography techniques, we enable high-precision definition of electrodes, diffractive surfaces, and microstructures compatible with various thin-film deposition and etching processes.
Capabilities
Capabilities
- Photolithography: UV and deep-UV exposure systems for micro-scale patterning (down to 1 µm).
- Maskless Lithography: Direct-write exposure for rapid prototyping and flexible pattern design.
- Etching & Development: Wet and dry etching (RIE, plasma) for metals, oxides, and polymers.
- Alignment & Layer Registration: Multi-layer alignment accuracy within submicron precision.
- Integration: Fully compatible with PVD, CVD, and vacuum coating processes for complex device architectures.
Applications
Applications
- Microelectrodes and sensor arrays for electrochemical and plasmonic detection.
- Diffractive and micro-optical structures for photonic components.
- MEMS and thin-film devices for medical and environmental monitoring.
- Prototype fabrication for research and industrial development projects.
R&D and Innovation
R&D and Innovation
Our lithography processes are continuously optimized through collaboration with academic and industrial partners, enabling the fabrication of high-resolution, reproducible, and scalable microstructures.
The division serves as a bridge between design, deposition, and characterization, ensuring precision and reliability across all fabrication stages.
Our lithography processes are continuously optimized through collaboration with academic and industrial partners, enabling the fabrication of high-resolution, reproducible, and scalable microstructures.
The division serves as a bridge between design, deposition, and characterization, ensuring precision and reliability across all fabrication stages.
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